Home > Search Results: keywords:"termodynamické namáhání"
Search:
Search Tips :: Advanced Search
Search collections:
Sort by: Display results: Output format:
National Repository of Grey Literature 2 records found  Search took 0.01 seconds. 
Modern methods for Chip Attach
 Nešpor, Dušan ; Novotný, Marek (referee) ; Szendiuch, Ivan (advisor)
The work deals with packaging and die attach issues. The general aim of this investigation is thermomechanical stress between package and substrate depending on different thermal and mechanical properties of used materials. Work contains modeling with program ANSYS and practical tests with testing packages. Determining a place in the solder with the maximal and the minimal stress values and determining of the stress distribution for all materials are the results of this research.
Detailed record
Modern methods for Chip Attach
 Nešpor, Dušan ; Novotný, Marek (referee) ; Szendiuch, Ivan (advisor)
The work deals with packaging and die attach issues. The general aim of this investigation is thermomechanical stress between package and substrate depending on different thermal and mechanical properties of used materials. Work contains modeling with program ANSYS and practical tests with testing packages. Determining a place in the solder with the maximal and the minimal stress values and determining of the stress distribution for all materials are the results of this research.
Detailed record

Interested in being notified about new results for this query?
Subscribe to the RSS feed.
Digital Repository :: Search :: Submit :: Personalize :: Help
Powered by Invenio v1.1.2
Maintained by admin.invenio@techlib.cz
This site is also available in the following languages:
Česky  English